Contents Volume 1
Plenary Session
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From Macroscopic to Nanoscopic Systems: Electrons in Nanostructures
H. v. Löhneysen, Universität Karlsruhe, Germany |
1 |
Progress and Profit through Microtechnologies
W. Ehrfeld, IMM Mainz, Germany |
9 |
Microoptical Technologies
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MOEMS - Technologies and Overview
M.E. Motamedi, REVOLTECH microsystems, Austria |
19 |
Leaky Waveguide Devices as Simple Sensitive Optical Detectors for Use in mTAS Applications
N. J. Goddard, K. Singh, R. J. Holmes, S. Mohr, J. Hulme, K. Joyce, F. Bounaira, P. R. Fielden, University of Manchester, UK |
27 |
Optical Bandpass Filters for Microsystems
S. Jakobs, U.B. Schallenberg, mso Jena GmbH, Germany |
33 |
Flexible Microassembly Setup for Optical Beam Transformation Systems for High Power Diode Laser Bars and Stacks
C. Gärtner, A. Kräplin, amt Jena; V. Blümel, Jenoptik Laserdiode GmbH; B. Höfer, P. Schreiber, Fraunhofer - IOF; T. Poßner, GRINTECH GmbH, Germany |
39 |
Nanotechnologies
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Nanotechnologies and Nanostructured Materials
R.W. Siegel, Rensselaer Polytechnic Institute, USA |
43 |
Nano- and Micro-Assembly of Molecular Components by means of Nucleic Acid Hybridization
Ch. M. Niemeyer, Universität Bremen, Germany |
45 |
Nanometer Scale Lateral Structures of MOS Type Layers
U. Hilleringmann, Universität Paderborn; T. Vieregge, J.T. Horstmann, Universität Dortmund, Germany |
49 |
Magnetoelectronics
S. Mengel, VDI Technologiezentrum Düsseldorf, Germany |
55 |
Actuator Technologies
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Microactuators - Principies, Applications, Trends
H. Janocha, Universität des Saarlandes, Germany |
61 |
An Optimized Fabrication Process for Microcoils Utilizing UV-Depth- Lithography and BCB
V. Seidemann, S. Büttgenbach, Technische Universität Braunschweig, Germany |
69 |
Micro-adjustment by Thermally Induced Strains Using Laser Technology
A. Huber, M. Geiger, Universität Erlangen, Nürnberg, Germany |
73 |
Fabrication of Micromechanical Capacitive Ultrasonic Transducers by Surface Micromachining
V. Foglietti, E. Cianci, IESS-CNR; G. Caliano, F. Galanello, M. Pappalardo, B. Mommi, University of Rome, Italy |
79 |
Optical and Microelectronic Components
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Optical Components for the Future Internet
C. Baack, Heinrich-Hertz-Institut für Nachrichtentechnik Berlin GmbH, Germany |
83 |
High-Speed, High-Responsitivity 1.55mm Photodetector on InP
A. Umbach, D. Trommer, R. Steingruber, A. Seeger, W. Ebert, G. Unterbörsch, Heinrich-Hertz-Institut für Nachrichtentechnik Berlin GmbH, Germany |
85 |
Optical Interconnect for Inter Processor Communication
B. Wittmann, A. Neyer, Universität Dortmund, Germany |
91 |
Fiber-Chip-Coupling Modules with up to 50 GHz Modulation Bandwidth and Reusable Fiber-Chip-Coupling Mechanism
Th. Eckhardt, O. Krips, U. H. P. Fischer, Heinrich-Hertz-Institut für Nachrichtentechnik Berlin GmbH, Germany |
95 |
Microoptical Components and Systems
W. Karthe, Fraunhofer-Institut für Angewandte Optik und Feinmechanik IOF, Germany |
101 |
Holographic Microstructures for Large-Area Applications
A. Gombert, B. Bläsi, V. Boerner, V. Kübler, M. Niggemann, Fraunhofer Institut für Solare Energiesysteme ISIE, Germany |
103 |
Microstructured Threedimensional Printed Circuit Boards: a Novel Fabrication Technology for Optical Transceiver Modules
H. Kragl, R. Hohmann, M. Loddoch, G. v. Papen, HARTING EOB GmbH & Co. KG; A. Guttzeit, A. Schlachetzki, Technische Universität Braunschweig, Germany |
107 |
Integration of Polymer Optical Waveguides into Printed Circuit Boards (PCB)
S. Lehmacher, A. Neyer, Universität Dortmund, Germany |
111 |
Fiber Optic Switches using Transmittive Microoptical Components
R. Göring, F. Wippermann, K. Kubitz, Piezosystem Jena GmbH; P. Dannberg, G. Leibeling, A. Bräuer, Fraunhofer IOF Jena, Germany |
115 |
Hybrid and Lens-Equipped Parallel Optical Interconnects Realised Using LIGA
H.-D. Bauer, W. Ehrfeld, T. Paatzsch, J. Schulze, Institut für Mikrotechnik Mainz GmbH, Germany |
121 |
The Fabrication and Application of Micro Milling Cutters
H.-W. Hoffmeister, A. Wenda, H. Herrmann, Technische Universität Braunschweig, Germany |
125 |
Smart Cards
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New Perspectives in Smart Card Technologies
B. Kowalski, Deutsche Telekom AG, Germany |
131 |
Secure Mobile Commerce: A"Plug and Pay" Approach
J. Posegga, T-Nova Technologiezentrum, Germany |
133 |
Smartcard: A Secure Platform for IT Security Services
B. Fuchs, Deutsche Telekom AG, Germany |
139 |
Secure JAVA Applications using Smart Cards
A. Reinhardt, ISS Technologies AG, Germany |
145 |
The Future of Contactless SmartCards
M. Hegenbarth, T-Nova Technologiezentrum, Germany |
149 |
Perspectives for E-Payment with the GeldKarte
F. Schlipplick, EUTELIS, Germany |
151 |
Storage Media
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Trends in Hard Disk Drive Technology
A. Dietzel, R. Berger, IBM Deutschland Speichersysteme GmbH, Germany |
155 |
Magneto-Optic Data Storage
P. Fumagalli, Universität Berlin, Germany |
159 |
The"Millipede" More than One Thousand Tips for Parallel and Dense AFM Data Storage
0. Vettinger, M. Despont, IBM Research Laboratory, Switzerland |
165 |
Optical Disk with Multiplexed Microholograms
S. Orlic, P. Kuemmel, H.J. Eichler, Technische Universität Berlin, Germany |
167 |
Fabrication and Characterization of Large Scale Periodic Magnetic Nanostructures for Future Magnetic Storage Technology
A. Carl, S. Kirsch, H. Mühlbauer, H. Weinforth, E.F. Wassermann, Universität Duisburg, Germany |
173 |
Automotive Bus Systems, Networking and Traffic Technologies
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The Audio/Video-Telematics Databus
C. Ciocan, Communication & Control Electronics Limited, UK |
179 |
SCAN - A Hardware Minimised Low Cost/Low Power Bus - A Functional Overview
H. Schrom, E. Schnieder, Technische Universität Braunschweig, Germany |
183 |
New Concepts in Automotive System Design
F. Bellotti, A. De Gloria, University of Genova, Italy |
187 |
Automotive Information, Communication and Navigation Systems, Automotive Displays
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New Display Technologies - Chance and Challenge for Driver Information
B. Straub, DaimlerChrysler AG, Germany |
191 |
A Novel Liquid Crystal Display Unit for an Arbitrarily Configurable Customer Tailored Instrument for Vehicle Applications
P.M. Knoll, M. Gebauer, J. Eschler, Robert Bosch GmbH, Germany; L. Andreone, S. Damiani, Centro Ricerche Fiat S.C.p.A., Italy |
193 |
New Simulation-Tool for Developing LCD-Backlights
M. Gebauer, P. Benoit, P. Knoll, Robert Bosch GmbH; M. Neiger, Universität Karlsruhe, Germany |
199 |
Multimedia Applications in Automobiles, Human Machine Interface Systems
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Multimedia Applications in Automobiles
P. Gonella-Pachiotti, ST Microelectronics, Italy |
205 |
A Graphical Tool for Closing the Chain between Design and Programming of Embedded Graphic Systems
A. M.. Meroth, U. Beutnagel-Buchner, Robert Bosch GmbH; V. Marks, ISC GmbH, Germany |
207 |
Choosing the Right Language: Is Java Suitable for Automotive Applications?
F. Bellotti, A. De Gloria, University of Genova, Italy |
213 |
Monitoring Devices
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Telemedicine - A Quantum Leap in Medical Care?
A. Bolz, Universität Karisruhe, Germany |
217 |
Development of a Miniaturized System in Home Application for a First Diagnosistic of Sleep Related Respiratory Diseases
D. Plattner, B. Schöller, MCC GmbH & Co. KG, Germany |
223 |
Cardiac Telemonitoring in Support of Therapy Surveillance and Management
H. Hutten, Technische Universität Graz, Austria |
227 |
Tele-Modules and Services for Establishing a Telematic Homecare and Ambulatory Care Platform for Patients and Elderly
J.-U. Meyer, M. Schäfer, M. Koch, Ch. Cleer, St. Kiefer, Fraunhofer-Institut für Biomedizinische Technik, Germany |
233 |
Monitoring System Evaluating Stress Produced by Tongue Movements on the Palate
O. Hohlfeld, R. Werthschützky, Technische Universität Darmstadt; G. Schuster, Zahnärztliches Universitäts-Institut der Stiftung Carolinum, Germany |
237 |
Implantable Microsystems 1
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Future of Electrical Implants
Schaldach, Universität Erlangen-Nürnberg, Germany |
243 |
CMOS Microtransceivers in Ophthalmology
S. Kolnsberg, K. Stangel, D. Hammerschmidt, M. Schwarz, B. J. Hosticka, L. Ewe, H.K. Trieu, W. Mokwa, Fraunhofer-Institut für Mikroelektronische Schaltungen und Systeme, Germany |
249 |
Wireless Eye Pressure Monitoring System Integrated into Intra-Ocular Lens
T. Eggers, Campus Micro Technologies GmbH, Germany; U. Marschner, ETO GmbH, Germany, C. Marschner, R. Laur, J. Binder, Universität Bremen; J. Draeger, UKE; K. Hille, Universitätskrankenhaus Homburg, Germany; P. Stegmaier, ETH Zurich, Switzerland |
255 |
Laser Microperforation of a Retina lmplant
E, Bremus-Köbberling, A. Gillner, Fraunhofer-Institut für Lasertechnologie; H.-Ch. Lüdtke-Handjery, H. Höcker, RWTH Aachen, Germany |
259 |
Fully Implantable Hearing System with Direct Electromechanical Stimulation of the Inner Ear
H. Leysieffer, IMPLEX AG, Germany |
267 |
Implantable Microsystems 2
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Implantable Mechanical Microsystems
H. Reul, RWTH Aachen, Germany |
271 |
Electrode-Substrate-Package Co-Design for Implantable Biomedical Microdevices
T. Stieglitz, M. Schüttler, H. Beutel, J.-U. Meyer, Fraunhofer-Institut für Biomedizinische Technik, Germany |
277 |
On the Design of Multi-Site Microelectrodes for Neuronal Recordings
U.G. Hofmann, Medizinische Universität Lübeck, Germany; E. De Schutter, University of Antwerpen, Belgium; K. Yoshida, University of Aalborg, Denmark; M. de Curtis, Instituto Nazionale Neurologico Carlo Besta, Italy; P. Norlin, ACREO AB, Sweden |
283 |
IMPLAS, the Body Chip
H. Flocke, J. Schulz, iC-Haus GmbH; A.Steiner, M. Mönich, Hytron GmbH, Germany |
289 |
An Inductive Power Supply for Long Term Monitoring System of Orthopaedic Implants
K. Salmi, O. Chevalerias, F. Rodes, ENSERB-IXL; B. Agostino, DCN, France |
293 |
Mini Endoscopy 1
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Evolving Endoscopic Techniques
E. Hahn, Universität Erlangen-Nürnberg, Germany |
299 |
Mini-Endoscopy in the Diagnostic and Treatment of Ear, Nose and Throat Diseases
H. Iro, J. Zenk, Universität Erlangen-Nürnberg, Germany |
301 |
Diagnostic and Therapeutic Mini-Endoscopy in Orthopedics and Traumatology
W. Siebert, Orthopädische Kliniken Kassel, Germany |
303 |
Flexible and Rigid Thin-Caliber-Endoscopy in Urology
W. Schafhauser, Universität Erlangen-Nürnberg, Germany |
309 |
Mini Endoscopy 2
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Endoscopic-Retrograde Mini-Endoscopy in Gastroenterology
J. F. Riemann, C. Benz, Krankenhaus Ludwigshafen, Germany |
311 |
Percutaneous-Transhepatic Fiber and Video-Endoscopy in the Biliary Tract
J. Hochberger, E. G. Hahn, Universität Erlangen-Nürnberg, Germany |
313 |
New Micro-Instruments for Interventional Endoscopy
M. Banik, Boston Scientific International, USA |
315 |
Mini Endoscopy 3
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Miniprobe Endoscopic Ultrasound - Future Perspectives
R. Tamm, Olympus Optical GmbH, Germany |
317 |
New Ultrasound Array Antennas
R. Lerch, Universität Erlangen-Nürnberg, Germany |
319 |
Miniprobe EUS for Diagnosis of Bile Duct Diseases
M. Gebel, Medizinische Hochschule Hannover, Germany |
325 |
Endoscopic Ultrasound and Echo-Enhancing Agents
D. Becker, Universität Erlangen-Nürnberg, Germany |
327 |
Résumé and Announcement of Coming Events
E. Hahn, Universität Erlangen-Nürnberg, Germany |
335 |
Drug Delivery Systems
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Effective Integration of Drug Delivery Considerations in the R&D Process
W. Malick, Hoffmann-La-Roche, USA |
337 |
A Controlled Release Microchip
J. Santini, MicroCHIPS Inc. Cambridge, Massachusetts, USA; M. J. Cima, B. Langer, Massachusetts Institute of Technology, USA |
339 |
New Drug Delivery Systems - Examples of Applied Nanotechnology
T. Sawitowski, AlCove Surfaces GmbH, Germany |
343 |
Design and Production
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Microreaction Technology - A Leap into a New Area of Chemical and Bio Engineering
H. Löwe, Institut für Mikrotechnik Mainz GmbH, Germany |
347 |
Dynamic Monitoring of Fluid Equipartition and Heat Release in a Falling Film Microreactor Using Real-Time Thermography
Ch. Wille, W. Ehrfeld, V. Haverkamp, Th. Herweck, V. Hessel, H. Löwe, Institut für Mikrotechnik Mainz GmbH; N. Lutz, K.-P. Möllmann, F. Pinno, Fachhochschule Brandenburg, Germany |
349 |
Glass as a Material for Microreaction Technology
A. Freitag, T. R. Dietrich, R. Scholz, mgt mikroglas technik AG, Germany; V. Hessel, Institut für Mikrotechnik Mainz GmbH, Mainz, Germany |
355 |
Microreactors in Chemical Synthesis
K. Golbig, M. Hohmann, T. Schwalbe, CPC Cellular Process Chemistry GmbH, Germany |
361 |
Mathematical Modelling
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Simulation of Microreaction Systems, Challenges and Opportunities
A.J. Przekwas, CFD Research Corp., USA
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365 |
Characterization of Micro Heat Exchangers
K.S. Drese, S. Hardt, Institut für Mikrotechnik Mainz GmbH, Germany |
371 |
Optimal Design for Flow Uniformity in Microchannel Reactors
J.M. Commenge, L. Falk, J.P. Corriou, M. Matlosz, LSGC - ENSIC - CNRS, France |
375 |
User Needs in Design Tools for Microsystems and Microreactors - A NEXUS Survey
P. Salomon, MEMSCAP GmbH, Germany |
381 |
Characterisation of Unit Operation and Reaction Modules
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"Scale Up vs Numbering Up" - Can Minlaturization Change the Rules in Chemical Processing ?
A. R. Oroskar, K. Van den Busche, G. Touler, UOP LLC Engineering Science Skill Center, USA |
385 |
Micromixing Technology for Chemical and Pharmaceutical Processing
V. Hessel, Institut für Mikrotechnik Mainz GmbH, Germany |
393 |
Gas-Liquid Contacting ans Reaction in Microstructured Microchemical Systems
M. W. Losey, R. Jackman, M.A. Schmidt, K.F. Jensen, Massachusetts Institute of Technology, USA |
395 |
New Non-Clogging Microreactor for Chemical Processing and Nano Materials
B. Penth, Synthesechemie Dr. Penth, Germany |
401 |
Power Semiconductors and Smart Power IC's
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Electronic Devices for Power Switching and Power Integrated Circuits: The Enabling Technology for Clean Energy
G. A. J. Amaratunga, University of Cambridge, UK, L. Lorenz, Infineon Technologies, Germany |
407 |
Fully lntegrated IGBT Gate Driver Controlling Four Switches
S. Pawel, J. Lehmann, M. Netze], Technische Universität Ilmenau; R. Herzer, J. Masannek, SEMIKRON Elektronik GmbH, Germany |
417 |
Application and Integration Opportunities in Switched Mode Power Supplies
H. van der Broeck, Fachhochschule Köln, Germany |
423 |
Integrated Power Electronic Building Blocks for High-Power Applications
R. W. De Doncker, RWTH Aachen, Germany |
431 |
Mini Storage Systems and Fuel Cells
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Mini Storage Systems
T. Hartkopf, Technische Universität Darmstadt, Germany |
435 |
Cost Optimization of Fuel Cell Combined Heat and Power Plants Managed by a Power Supply Company
R. Friedrich, H.-J. Koglin, Universität des Saarlandes, Germany |
441 |
Microreaction Technology in Fuel Processing for Fuel Cell Vehicles
I. Hermann, M. Lindner, H. Winkelmann, Adam Opel AG, Germany; H. G. Düsterwald, McKinsey & Company Inc. Düsseldorf, Germany |
447 |
Prospects of a Setup of Decentralized Energy-Conversion-Systems with Smaller Output in the Electric Low-Voltage-Network
E. Handschin, W. Horenkamp, Th. Wiesner, Universität Dortmund, Germany |
455 |
BMBF - Projects Poster Session
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C 1.1 Hybrid Assembly of Microoptical Systems
R. Eberhardt, T. Scheller, unique-m.o.d.e. AG, Germany; M. Mohaupt, Fraunhofer IOF, Germany |
459 |
C 1.2 A Novel Micromachined 2x128-Element Linear Thermoelectric Infrared Radiation Sensor Array
J. Müller, V. Baier, U. Dillner, R. Güttich, E. Kessler, Institut für Physikalische Hochtechnologie e. V., Germany |
465 |
C 1.3 The lnjection Moulding of Fine Structurized Optical Surfaces
H. Kießling, Fraunhofer IOF, Germany; B. Hummel, E & G GmbH, Germany; W. Müller, Wahl Kunststoffoptik, Germany |
471 |
C 1.4 Materials Data Base for the Simulation of Microsystem Components (SiMiKo)
M. Mahlich, B. Kocdemir, H.-J. Fecht, Universität Ulm, Germany |
473 |
C 1.5 Novel Migration Resistant Aluminium Based Metallizations for Surface Acoustic Wave Devices (EXTREM)
J. W. Mrosk, L. Berger, C. Ettl, H.-J. Fecht, Universität Ulm, Germany; U. Wolff, Siemens AG, Germany |
477 |
C 1.6 lnnovative Design Approach for a Frontend for Wireless Communication
R. Dolp, N. Scheffer, EADS Deutschland GmbH, Ulm, Germany |
483 |
C 1.7 Reliability of Non-Volatile Memories for Microsystems
L. Nebrich, J.-W. Zahlmann-Nowitzki, P. Seegebrecht, Christian-Albrechts-Universität Kiel, Germany |
485 |
C 1.8 Direct Control of Cutting Tools by Novel Microtechniques
H. Luethje, T. Löhken, R. Böttcher, Fraunhofer IST, Braunschweig, Germany |
489 |
C 1.9 Miniaturized Fiber-Coupled E-Field Sensor
R. Heinzelmann, D. Kalinowski, A. Stöhr, D. Jäger, Universität Duisburg, Germany |
495 |
C 1.10 Sensors for Exhaust Gas Analysis
R. Mayer, G. Reinhardt, Universität Tübingen V. Brüser, W. Klingner, Zirox Sensors & Electronics GmbH U. Guth, Kurt-Schwabe-Institute for Measuring & Sensor Technology e. V. Meinsberg, Germany |
501 |
C 1.11 Microproduction -Trends in Product Design - Effects on Production
A. Steck,W. Schäfer, Fraunhofer IPA, Germany |
505 |
C 1.12 Innovative Low-Cost Microspectrometer
S. Kreuzberger, STEAG microparts GmbH, Germany |
513 |
C 1.13 Micromechanical Pressure Sensor in CMOS-Technology
D. Bollmann, Fraunhofer IZM, Germany |
515 |
C 1.14 New Measurement Mode with On-Chip Heating of QMB Sensors
P. Boeker, T. Rechenbach, P. Schulze Lammers, Universität Bonn, Germany; G. Horner, HKR Sensorsysteme GmbH, München, Germany; St. Rösler, FOQ Piezotechnik GmbH, Bad Rappenau, Germany |
517 |
C 1.15 On-Chip Programmable Monolithic Integrated Pressure Sensor for High Pressure Application
H. K. Trieu, 0. Köster, M. Knier, H. Kappert, W. Mowka, Fraunhofer IMS; |
523 |
C 1.16 Chip Design of a Fuzzy Controller Used in Micropumps and -valves
W. Jeroch, Fraunhofer IMS, Germany |
529 |
C 1.17 Development and Use of Microsensors with Fully Automatically Dispensed Membranes
M. Wieland, C. Jörgensen, W. Künnecke, TRACE Biotech AG, Braunschweig, Germany |
533 |
C 1.18 Modularized Microelectromechanical Systems
G. Bauer, M. Schünemann, W. Schäfer, Fraunhofer IPA, Stuttgart, Germany; V. Großer, R. Leutenbauer, K. Amiri Jam, Fraunhofer IZM, Berlin, Germany |
537 |
C 1.19 Hybrid On-Line Vibration Diagnosis Microsystem with Trend Analysis and Neural Classification
U. Marschner, I. Jossa, W.-J, Fischer, Technische Universität Dresden, Germany; G. Elender, T. Herrmann, Loher AG, Ruhstorf a. d. Rott, Germany; M. Heinrich, Radeberger Hybridelektronik GmbH, Radeberg, Germany |
543 |
C 1.20 Wireless Eye Pressure Monitoring System Integrated into Intra-Ocular Lens
C. Marschner, T. Eggers, R. Laur, J. Binder, Universität Bremen; J. Draeger, Universitäts Klinik Hamburg Eppendorf; K. Hille, Universitäts Klinik Homburg; Germany; P. Stegmaier, ETH Zürich, Switzerland |
549 |
C 1.21 Packaging of Electronic Devices for Automotive Applications Using Transfer Moulding Process
P. Lange, J. Reuter, Hella KG Hueck & Co., Lippstadt, Germany; H. Kühn, Technische Universität Dresden, Germany; A. Remuta, Maschinenfabrik Lauffer GmbH & Co. KG, Horb a. N., Germany |
555 |
C 1.22 A Chemical Microactuator for a Microanalytical Device and its Application in the Analysis of Environmental Water
K. Dobos, ENVIS GmbH, Herzebrock, Germany; K.-H. Pettinger, Compur Monitors, München, Germany |
559 |
C 1.23 MicroShape - Reverse Engineering in Microsystem Technology
V. Schillen, FZI, Germany; G. Storz, Universität Karlsruhe, Germany |
563 |
C 1.24 MPL - A Rapid Prototyping Method for Manufacturing of Micro Mechanical Parts
V. Schillen, FZI, Germany |
571 |
C 1.25 Metal Oxide Gas Sensor Array on Common Silicon Substrate for Ammonia Detection
J. Wöllenstein, M. Jägle, G. Kühner, H. Böttner, Fraunhofer IPM, Freiburg, Germany; O. Kiesewetter, Umweltsensorentechnik GmbH, Geschwenda, Germany
|
577 |
C 1.26 Microoptical Sensor Systems
H. Wurzbacher, E, Manske, W. Schott, G. Jäger, H. Büchner, R. Grünwald, Technische Universität Ilmenau, Germany |
579 |
C 1.27 Development of a Thermally Actuated Pneumatic 3/2-Way-Microvalve
G. Günther, RWTH Aachen, Germany; H.-J. Quenzer, Fraunhofer ISIT, Itzehoe, Germany |
585 |
C 1.28 Modelling and Simulation of Periodic Processing of Microreactors
T. Stief, O.-U. Langer, DECHEMA e.V., Germany |
589 |
C 1.29 Mechatronic Solutions for Modular MEMS
V. Hillmann, K. Amiri Jam, T. Braun, K.-F. Becker, F. Ansorge, V. Großer, H. Reichl, Fraunhofer IZM, Germany |
593 |
C 1.30 Cascaded Micro Channel Cooling of High Power Diode Laser Bars
D. Lorenzen, Jenoptik Laserdiode GmbH, Germany |
595 |
C 1.31 Integration of Micromechanic Sensors, Actuators and Miniaturized High Temperature Electronics in Advanced Transmission Systems
T. Riepl, G. Lugert, Siemens AG Regensburg, Germany; R. Ingenbleek, W. Runge, ZF Friedrichshafen AG; T. Riepl, Siemens AG, Germany; L. Berchthold, pretema GmbH, Niefern, Germany |
599 |
C 1.32 Promotion of Micro Systems Technology
J. Berger, W. Claußen, VDI/VDE-IT GmbH, Germany |
605 | |