CIPS 2018 | 20 - 22 March 2018 | Stuttgart
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Conference on Integrated Power Electronics Systems

In 2018 the successful story of CIPS will continue as the conference focus is today more important than ever – increasing functionality, energy efficiency and system reliability while decreasing cost.

The final program is available now!

Andreas Lindemann, Otto-von-Guericke-University Magdeburg; Nando Kaminski, University of Bremen
Technical Program Chairmen

Registration Fees

  • VDE/IEEE/ECPE Member* - €690,-
  • Presenting Author - €600,-
  • Regular - €790,-
  • Student *- €520,-

* The reduced fees are only valid with the indication of the member card number (for VDE Members) or upload of the member card copy (for other organisations) and for student the upload of the student card copy during the online registration form. In case of missing certification the non member fees will apply.

Services: The registration fees include the participation to the oral sessions, the poster session, the visit of the exhibition, the catering during the confernece days as well as the proceedings.

Cancellation:  In case of cancellation, provided that VDE-Conference Services has received written notice about it 30 days before the conference, the registration fee will be full refunded less a handlling fee of € 50.00. In case of cancellation after this date, no refund will be made. Proceedings and CD-ROM will then be sent to the registrant after the conference.

Visa Letter Enquiry: All participants who need a Visa Confirmation Letter are requested to send an email providing the information below to vde-conferences@vde.com with subject CIPS 2018 - Confirmation letter for VISA application. Please note that visa application letter will be sent only after completed registration.

Full Name
Company
Date of Birth
Passport No.
Date of Expiry
Date of Issue
Place of Issue

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Accommodation

A wide variety of hotel rooms in various categories have been prereserved via the hotel agency.

A wide variety of hotel rooms in various categories have been prereserved via the hotel agency.

We have rooms blocked in the conference venue Maritim Hotel Stuttgart:

Room Reservation at Maritim Hotel Stuttgart:

 

Please contact the hotel directly at:
reservierung.stu@maritim.de or by phone at +49 711 942 1210

The reservation code is CIPS 2018 (the rooms are blocked until January 31st, 2018).

 

 

We have also selected other htels which can be booked via the Hotel booking link below:

Please use the hotel booking form latest by 31.01.2018.

Downloads + Links

Venue

Maritim Hotel Stuttgart

Maritim Hotel Stuttgart

Distances 

  • Main railway station:  1.5 km
  • Motorway:  8 km
  • Airport:  14 km
  • Trade fair centre:  13 km
  • Old and New Castles:  1 km

Prices and Transportation 

Taxi fares

  • From airport: approx. 25-30 €
  • From main station: approx. 5-10 €

Busses and trams

  • From airport:
    S2 in direction to "Schorndorf" or S13 in direction to "Kircheim (T)"
    to stop "Stadtmitte" (Rotebühlplatz)
    take tramway U14 in direction to "Neckargröningen Remseck"
    to stop "Berliner Platz" (Hohe Straße)
  • From main station:
    tramway U29 in direction to "Botnang" to stop "Berliner Platz" (Liederhalle) or
    tramway U14 in direction to "Heslach Vogelrain" to stop "Berliner Platz" (Liederhalle)
Maritim Hotel Stuttgart

Target Audience

We invite all engineers coming from industry and academia engaged in power electronics-related

  • system development
  • component development
  • reliability engineering
  • research

to learn more about the latest research and technical achievements by joining CIPS.

Conference Topics

  • Introduction
  • Clean switching, electromagnetic compatibility (EMC)
  • EMC, Components to be integrated
  • Reliability
  • Components to be integrated
  • General aspects of packaging
  • Power packages and modules
  • Mechatronic systems and their applications
  • Condition Monitoring (Reliability)
  • Degradation of Interconnects
  • EMI (Clean switching, electromagnetic compatibility)
  • Clean switching, electromagnetic compatibility
  • Mechatronic systems and their applications
  • Packaging

Committee Members

General Chairs

Leo Lorenz, ECPE e.V.
Thomas Harder, ECPE e.V.


Technical Chairs

Andreas Lindemann, Otto-von-Guericke-University Magdeburg
Nando Kaminski, University of Bremen


Honorary Chairs

Dieter Silber, University of Bremen
Eckhard Wolfgang, ECPE e.V.


Award Chairs

Regine Mallwitz, Technical University Braunschweig
Jochen Koszescha, ECPE e.V.

Technical Program Committee

Bruno Allard, INSA Lyon, France
Stephane Azzopardi, Safran, France
Christopher Bailey, University of Greenwich, United Kingdom (Great Britain)
Frede Blaabjerg, Aalborg University, Denmark
Dushan Boroyevich, Virginia Tech, USA
Giovanni Breglio, University Naples, Italy
Bruno Burger, Fraunhofer-Institut für Solare Energiesysteme ISE, Germany
Giovanni Busatto, University of Cassino, Italy
Cyril Buttay, Université de Lyon Laboratoire Ampere CNRS UMR 5005, France
Mauro Ciappa, ETH Zurich, Switzerland
Guy Clerc, Université de  Lyon, Lyon1 Claude Bernard, France
Jose A. Cobos, Universidad Politécnica de Madrid (UPM), Spain
Gerard Coquery, IFSTTAR, France
Rik De Doncker, RWTH Aachen, Germany
Gerald Deboy, Infineon Technologies Austria AG, Austria
Enrique J. Dede, G.H.Elin International S.A., Spain
Philippe Dupuy, Freescale Semiconductor Inc., France
Hans-Günter Eckel, Universität Rostock, Germany
Bernd Engel, TU Braunschweig, Germany
Alfred Engler, Liebherr-elektronik GmbH, Germany
Fausto Fantini, Università degli Studi di Modena e Reggio Emilia, Italy
Braham Ferreira, Delft University of Technology, The Netherlands
Hans-Peter Feustel, Conti Temic Microelectronic GmbH, Germany
Peter Friedrichs, Infineon, Germany
Michael Frisch, Vincotech GmbH, Germany
Niels Gade, Danfoss Drives A/S, Denmark
Herbert Gambach, Siemens AG, Germany
Jean-Yves Gauthier, Laboratoire Ampère, France
Norbert Grass, Georg-Simon-Ohm University Nuermberg, Germany
Stefan Gutschling, ZVEI e.V., Germany
Thomas Harder, European Center for Power Electronics (ECPE e.V.), Germany
Marcel Held, Empa Swiss Federal Laboratories for Materials Testing and Research, Switzerland
Marcel Hendrix, Philips Innovation Services, The Netherlands
Eckart Hoene, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM, Germany
Klaus Hoffmann, Helmut-Schmidt-Universität, Germany
Francesco Ianuzzo, Aalborg University, Denmark
Bing Ji, University of Leicester, United Kingdom (Great Britain)
Steve Jones, Dynex Semiconductor, United Kingdom (Great Britain)
Sukhvinder Kang, Aavid, USA
Christian Keller, GE Power Conversion GmbH, Germany
Ralph Kennel, Technical University of Munich, Germany
Ulrich Kirchenberger, STMicroelectronics, Germany
Wlodzimierz Koczara, Warsaw University of Technology, Poland
Johann. W. Kolar, ETH Zurich, Switzerland
Jochen Koszescha, ECPE, Germany
Kai Kriegel, Siemens AG, Germany
Dominique L'hotellier, VEDECOM, France
Patrick Leteinturier, Infineon, Germany
Romeo Letor, ST Microelectronics, Italy
Thomas Licht, Hochschule  Düsseldorf, Germany
Stefan Linder, Alpiq, Switzerland
Leo Lorenz, ECPE, Germany
Josef Lutz, Chemnitz University of Technology, Germany
Johann Maier, AB Mikroelektronik GmbH, Austria
Laura Marlino, ORNL, USA
Rainer Marquardt, Universität der Bundeswehr München, Germany
Christian Martin, Univ Lyon, UCB Lyon 1, CNRS, AMPERE, France
Martin März, FhG Erlangen, Germany
Phil Mawby, University of Warwick, United Kingdom (Great Britain)
Patrick McCluskey, University of Maryland, USA
Michel Mermet-Guyennet, ALSTOM Transport, France
Axel Mertens, Leibniz Universität Hannover, Germany
Stefan Mollov, Mitsubishi Electric R&D Centre Europe, France
Herve Morel, Université de Lyon, INSA Lyon, Lab Ampère, CNRS, France
Jean Michel Morelle, VALEO, France
Mark Niels Münzer, Infineon Technology, Germany
Akio Nakagawa, Toshipa Corp., Japan
Ettore Napoli, University of Naples, Italy
Khai D.T. Ngo, Virginia Tech, USA
Mathias Nowottnick, University of Rostock, Germany
Cian Ó Mathúna, Tyndall National Institute, Ireland
Hiromichi Ohashi, NPERC-J, Japan
Ichiro Omura, Kyushu Institute of Technology, Japan
Frank Osterwald, Danfoss Silicon Power GmbH, Germany
Volker Pickert, Newcastle University, United Kingdom (Great Britain)
Robert Plikat, Volkswagen AG, Germany
Peter Prenninger, AVL List GmbH, Austria
Derk Reefman, Philips Research, The Netherlands
Tobias Reimann, Technische Universität Ilmenau, Germany
Volker Rischmüller, Robert Bosch GmbH, Germany
Martin Rittner, Robert Bosch GmbH, Germany
Andreja Rojko, ECPE, Germany
Evgenii Rudnyi, CADFEM GmbH, Germany
Uwe Scheuermann, Semikron Elektronik GmbH & Co. KG, Germany
Oliver Schilling, Infineon AG, Germany
Andreas Schlögl, Infineon, Germany
Roland Schmidt, Siemens AG, Germany
Martin Schneider-Ramelow, Fraunhofer IZM, Germany
Jürgen Schuderer, ABB Corporate Research, Switzerland
Hans-Joachim Schulze, Infineon Technologies AG, Germany
Emanuele Scrofani, STMicroelectronics, Italy
Hans Dieter Silber, Universit Bremen, Germany
Stefan Spannhake, Bosch Engineering GmbH, Germany
Paolo Spirito, University of Napoli "Federico II", Italy
Markus Thoben, Infineon Technologies AG, Germany
Shimizu Toshihisa, Tokyo Metropolitan University, Japan
Jan Vobecky, ABB, Switzerland
Gerhard Wachutka, Technische Universität München, Germany
Eberhard Waffenschmidt, TH Köln, Germany
Olaf Wittler, Fraunhofer IZM, Germany
Wolfgang Wondrak, Daimler AG, Germany
Dehong Xu, Zhejiang University, P.R. China
Peter Zacharias, Universität Kassel, Germany
Stefan Zudrell-Koch, BRUSA Elektronik AG, Austria

Downloads

Proceedings

The proceedings will be published by VDE Publishing House.

The proceedings will be published by VDE Publishing House.

All the accepted papers will be published as proceedings (limited edition).

A few months after the conference, the papers will be available for purchase as single pdf file.

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