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Exhibitors' List

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Bs&T (1)

Bs&T Frankfurt am Main GmbH

Bs&T (1)

Product / Know-How:

Bs&T is specialist for measuring technique of soft magnetic materials under high excitation (sinusoidal and pulse), for non linear behavior of hysteresis loop for material development, inductive component design. BsT-x BH Analyzer concept is compliant to IEC62044-3, BsT-Pro is capable of measuring non linear soft magnetic properties under high excitation under biased condition. BsT-pulse based on Thyristor Technology, driving power magnetic components bipolar in saturation, the demagnetization provides essential information as loss. BsT-SQ is designed for AC loss of inductor under repetitive pulse condition.

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DOWA HD Europe GmbH

The DOWA group was founded in 1884 in Akita/Japan. By harnessing in technologies and operational experiences in mining and smelting, we today operates unique businesses that range extensively from production of metals to materials for electronic devices.
For power electronics applications we, DOWA, have developed and manufacture high-performance metal-ceramics substrates as well as  baseplate materials for over 20 years.
For inventors of industrial machinery, for highspeed railway, for solar and wind power, we are producing AMB substrates with superior heat dissipation and high voltage endurance.
For automotive applications which require superb heat cycles endurance under severer conditions, ALMIC (DAB substrates) and Integrated Substrates, developed our own MCB process, have been selected.
In additions, we are producing Cu baseplate materials which are an effective combination of high thermal conductivity, high softening resistance and high tensile strength for the usage as heatsink bases, head spreaders, high current terminals, bus bars, lead frames.

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ECPE

ECPE - The Industrial and Research Network for Power Electronics in Europe

ECPE

The main objective of ECPE European Center for Power Electronics e.V. is pre-competitive research, education and advanced training as well as public relations for power electronics in Europe. For an efficient realisation two legal bodies have been established, the registered association ECPE e.V. and the limited company ECPE GmbH.

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Fraunhofer IISB (2)

Fraunhofer IISB

Fraunhofer IISB (2)

The research field is packaging of power electronics. The drivers are performance, volume and weight per cost depending on the application. The goal is reached by investigations of different concepts of the electrical, mechanical and thermal design such as single and double sided die attach, single and double sided cooling, materials with minimized or matched coefficient of thermal expansion (CTE). By use of intelligent setups and application relevant measures of the electrical and thermal interconnections the bill of material is minimized.

Work is done on joining technologies as well. There is a long experience in silver sintering as an alternative to the state of the art. Meanwhile a process is established to manufacture multichip power modules with high yield. Especially a selective sintering process brings big pace to electronic packaging, especially on printed circuit board. The chips sizes meet the power electronics requirements. While the sintering improvements are ongoing the soldering technology is still covered for new high performance or high temperature materials.

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Fraunhofer IZM

Heraeus Deutschland GmbH & Co. KG

Heraeus Electronics – a Global Business Unit of the Heraeus Group – is one of the leading manufacturers of materials for the assembly and packaging of devices in the electronics industry. The company deals with sophisticated materials solutions for consumer electronics and computing, automotive, LED, industrial – power electronics as well as communications.

 

Core competences include bonding wires, assembly materials, thick film pastes as well as roll clad strips and substrates.

www.heraeus-electronics.com

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ISP System

ISP System is a leading manufacturer of fully automated high precision mechatronics systems and manufacturing equipments.

The offering includes laser selective soldering machine, adhesive die bonder, and together with our partners we have developed an innovative sintering process allowing high thermal conductivity assembly for power packaging.

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Plexim

PLECS, the Simulation Platform for Power Electronic Systems

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