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2018-01-23 1435 0

Program

Conference Topics

VDE
  • Introduction
  • Clean switching, electromagnetic compatibility (EMC)
  • EMC, Components to be integrated
  • Reliability
  • Components to be integrated
  • General aspects of packaging
  • Power packages and modules
  • Mechatronic systems and their applications
  • Condition Monitoring (Reliability)
  • Degradation of Interconnects
  • EMI (Clean switching, electromagnetic compatibility)
  • Clean switching, electromagnetic compatibility
  • Mechatronic systems and their applications
  • Packaging

Program - CIPS 2018

Publishing date: 2018-01-23
Valid to: 2018-03-20
PDF 341 KB