EMLC

www.emlc-conference.com

| Photo provided by Toppan Photomasks
2018-10-08 event information 645 0

Information for Authors

Call for Papers

Publishing date: 2018-10-30
Valid to: 2019-04-25
PDF: 2 MB

General Information

VDE
  • Authors must follow the SPIE Abstract and manuscript preparation and submission guidelines.
  • The conference language is English.
  • The accepted manuscripts will be published in the proceedings by SPIE and made available at the SPIE Digital Library. Your manuscript is supposed to have a minimum size of 4 and a maximum size of six pages for oral/ poster presentations.
  • PDF files of presentation materials (oral, poster) will be published at the EMLC-Homepage, protected by a pin code.

Important dates

PhaseDateuntil
Abstract Submissionbefore April 12th, 2019
Announcement: Acceptance letters for authorsbeginning of May, 2019
Publication of the program on the websiteMay 2019
Authors' submission of manuscripts to SPIEJune 18th, 2019July 2nd, 2019
Early bird registrationMay 20th, 2019
Authors' preparation of presentation slides and short biographyJune 6th, 2019
EMLC Conference 2019June 17th, 2019June 19th, 2019

Icon Themen

Conference topics

Icon Themen

Mask Manufacturing and Mask Business

  • Multi-Beam Writing of Leading-Edge Masks and NIL Master Templates
  • Mask Data Preparation
  • Pattern Generation: Writing, Etch, etc.
  • Photomask Processes & Materials
  • Metrology Tools & Technologies
  • Defect Inspection & Repair
  • Cleaning & Haze
  • Pellicles & Mask Boxes
  • Mask Process Yield & Cycle Time
  • Photomasks for RET (OPC, ILT) ; PSM
  • Mask Business and Management
  • Mask Cost and Mask Development Strategy
  • Future Mask Demand

 Lithographic Systems and Processes

  • Optical Resolution Enhancements including OPC, Freeform Illumination, Source-Mask-optimization (SMO) and Inverse Lithography Technology (ILT)
  • Material-and Process driven Resolution Enhancements including Multiple Patterning and Chemical Shrinking
  • Immersion Lithography including Defectivity
  • Lithography Process Control
  • Lithography and Etch Simulation including rigorous physical/chemical Models and Compact Models

 Emerging Mask and Lithography Technologies

  • EUV-Lithography including Masks, Materials Processes and Infrastructure.
  • Nano-Imprint Lithography (NIL)
  • Directed Self-Assembly (DSA) including High Chi Materials, Defectivity Control, and new Processes
  • Direct Write / Maskless Technologies 

Emerging Applications

  • Non-IC Applications including Si-Photonics, Flat Panel Displays and MEMS
  • Lithographic Systems for non-IC Applications, including Laser Direct Write, Interference Lithography, and Mask Aligners
Icon Download

Downloads

Icon Download
Downloads + Links

Cooperating Partners