EMLC

www.emlc-conference.com

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2018-10-08 event information 214 0

Information for Authors

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Call for Abstracts

We invite you to present your researches or projects by submitting an abstract.

Deadline for submission of abstracts is

April 12th, 2019

 

Instructions for Abstract Submissions

Please submit your abstract as a word file, and as a two-page pdf-file, observing the guidelines provided by SPIE.

The abstract text should include figures, diagrams, and formatted text. We recommend an abstract length of two pages. Please use Times New Roman script for text and figure captions. The font size of title should be 16pt bold, font size of author name(s) and affiliations 12pt, font size of text passages 10pt, and of captions 9pt.

Abstract quality will be the basis for selection of conference presentations. The abstracts will be assessed for:

  • Originality of work
  • Specific results reported
  • Potential impact and interest to the attendees.

Commercial papers, papers with no new research / development content, and papers where significant information is missing will not be accepted.

By submitting an abstract you agree to

  • Present your work in person at the conference (compulsory)
  • Submit a manuscript and/ or your presentation materials in time

Authors will be notified of the acceptance of their submissions after April 12th, 2019; further manuscript format and layout instructions will be provided at that time.

 

Submit your abstract

Call for Papers

Publishing date: 2018-10-30
Valid to: 2019-04-25
PDF: 2 MB

General Information

VDE
  • Authors must follow the SPIE Abstract and manuscript preparation and submission guidelines.
  • The conference language is English.
  • The accepted manuscripts will be published in the proceedings by SPIE and made available at the SPIE Digital Library. Your manuscript is supposed to have a minimum size of 4 and a maximum size of six pages for oral/ poster presentations.
  • PDF files of presentation materials (oral, poster) will be published at the EMLC-Homepage, protected by a pin code.

Important dates

PhaseDateuntil
Abstract Submissionbefore April 12th, 2019
Announcement: Acceptance letters for authorsbeginning of May, 2019
Publication of the program on the websiteMay 2019
Authors' submission of manuscripts to SPIEJune 18th, 2019July 2nd, 2019
Early bird registrationMay 20th, 2019
Authors' preparation of presentation slides and short biographyJune 6th, 2019
EMLC Conference 2019June 17th, 2019June 19th, 2019

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Conference topics

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Mask Manufacturing and Mask Business

  • Multi-Beam Writing of Leading-Edge Masks and NIL Master Templates
  • Mask Data Preparation
  • Pattern Generation: Writing, Etch, etc.
  • Photomask Processes & Materials
  • Metrology Tools & Technologies
  • Defect Inspection & Repair
  • Cleaning & Haze
  • Pellicles & Mask Boxes
  • Mask Process Yield & Cycle Time
  • Photomasks for RET (OPC, ILT) ; PSM
  • Mask Business and Management
  • Mask Cost and Mask Development Strategy
  • Future Mask Demand

 Lithographic Systems and Processes

  • Optical Resolution Enhancements including OPC, Freeform Illumination, Source-Mask-optimization (SMO) and Inverse Lithography Technology (ILT)
  • Material-and Process driven Resolution Enhancements including Multiple Patterning and Chemical Shrinking
  • Immersion Lithography including Defectivity
  • Lithography Process Control
  • Lithography and Etch Simulation including rigorous physical/chemical Models and Compact Models

 Emerging Mask and Lithography Technologies

  • EUV-Lithography including Masks, Materials Processes and Infrastructure.
  • Nano-Imprint Lithography (NIL)
  • Directed Self-Assembly (DSA) including High Chi Materials, Defectivity Control, and new Processes
  • Direct Write / Maskless Technologies 

Emerging Applications

  • Non-IC Applications including Si-Photonics, Flat Panel Displays and MEMS
  • Lithographic Systems for non-IC Applications, including Laser Direct Write, Interference Lithography, and Mask Aligners
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