EMLC

www.emlc-conference.com

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2018-08-06 event information 3260 0

Program

The focus of this 3 day conference is state-of-the-art of mask technology and lithography, such as mask manufacturing, mask business, lithography and mask applications, emerging mask & lithography technologies, and mask & lithography equipment.

Tutorial Speakers

Andreas Erdmann

Andreas Erdmann, 1st Tutorial

Andreas Erdmann / FhG IISB, Erlangen, Germany,

Head of the Fraunhofer IISB lithography and optics group

"Alternative Lithographic Techniques for Non-IC Applications"

Andreas Erdmann

Andreas Erdmann / FhG IISB, Erlangen, Germany,

Head of the Fraunhofer IISB lithography and optics group

"Alternative Lithographic Techniques for Non-IC Applications"

Laurent Pain

Laurent Pain, 2nd Tutorial

Laurent Pain, CEA-LETI, Grenoble, France

Head of Business Development Silicon Technologies

Division Patterning program manager

"Lithography Alternative Solutions"

Laurent Pain

Laurent Pain, CEA-LETI, Grenoble, France

Head of Business Development Silicon Technologies

Division Patterning program manager

"Lithography Alternative Solutions"

Sczyrba

Martin Sczyrba, 3rd Tutorial

Martin Sczyrba, Advanced Mask Technology Centre GmbH & Co KG (AMTC),

Dresden Germany

Senior Member of Technical Staff – Line Engineering

„Photomask Making Processes and Technologies”

Sczyrba

Martin Sczyrba, Advanced Mask Technology Centre GmbH & Co KG (AMTC),

Dresden Germany

Senior Member of Technical Staff – Line Engineering

„Photomask Making Processes and Technologies”

Keynote Speakers

Bischof

Udo Bischof, 1st Keynote

Udo Bischof, Robert Bosch GmbH, Reutlingen, Germany

Director Engineering Sensor Process Technology (EPT)

“Future Trends and Drivers for Sensor Technologies”

Bischof

Udo Bischof, Robert Bosch GmbH, Reutlingen, Germany

Director Engineering Sensor Process Technology (EPT)

“Future Trends and Drivers for Sensor Technologies”

Naoya Hayashi

Naoya Hayashi, 2nd Keynote

Naoya Hayashi, Dai Nippon Printing Co., Ltd (DNP), Fukuoka, Fujimino, Saitama, Japan

“Electron Multi-Beam Writing of Leading-Edge Masks and

NIL Master Templates”

Naoya Hayashi

Naoya Hayashi, Dai Nippon Printing Co., Ltd (DNP), Fukuoka, Fujimino, Saitama, Japan

“Electron Multi-Beam Writing of Leading-Edge Masks and

NIL Master Templates”

Harry Levinson, 3rd Keynote

Harry J. Levinson, HJL Lithography, USA

“The Potential of EUV Lithography”

Harry J. Levinson, HJL Lithography, USA

“The Potential of EUV Lithography”

Invited Speakers in sequence of the EMLC2019 Program

FRANKE_Robert_Photo_103

Robert Franke, Invited Speaker

Robert Franke, Department of Economics Development, Dresden, Germany

Director Office of Economics Development – City of Dresden

“Smart City Dresden - Bringing Future Technologies on the Road”

FRANKE_Robert_Photo_103

Robert Franke, Department of Economics Development, Dresden, Germany

Director Office of Economics Development – City of Dresden

“Smart City Dresden - Bringing Future Technologies on the Road”

André Eilert, Invited Speaker, Best Poster of BACUS Photomask Technology 2018

André Eilert, Advanced Mask Technology Center GmbH Co. KG, Dresden, Germany

Process Engineer

“Multiple exposure on single blank for electron-beam

writer characterization”

André Eilert, Advanced Mask Technology Center GmbH Co. KG, Dresden, Germany

Process Engineer

“Multiple exposure on single blank for electron-beam

writer characterization”

Takahiro-Mori

Takahiro Mori, Invited Speaker, Best Paper of PMJ2019 (Photomask Japan)

Takahiro Mori, Mitsubishi Chemical Corporation, Ushikawadori, Toyohashi, Aichi, Japan

Scientist High Performance Chemicals Laboratory

“aquaSave™: Antistatic Agent for Electron Beam Lithography”

Takahiro-Mori

Takahiro Mori, Mitsubishi Chemical Corporation, Ushikawadori, Toyohashi, Aichi, Japan

Scientist High Performance Chemicals Laboratory

“aquaSave™: Antistatic Agent for Electron Beam Lithography”

Masahiro Hashimoto, Invited Speaker

Masahiro Hashimoto, HOYA Group / Blanks division, Nagasaka, Hokuto, Yamanashi, Japan

General Manager, Optical Blanks Technology Development,

”Continuous challenges for next era of lithography”

Masahiro Hashimoto, HOYA Group / Blanks division, Nagasaka, Hokuto, Yamanashi, Japan

General Manager, Optical Blanks Technology Development,

”Continuous challenges for next era of lithography”

SCHNETTELKER_Annette_Photo1

Annette Schnettelker, Invited Speaker

Annette Schnettelker, IMS Nanofabrication GmbH, Vienna, Austria

Technical Project Manager

”MBMW-201 – The multi-beam mask writer advanced to the 2nd tool generation”

SCHNETTELKER_Annette_Photo1

Annette Schnettelker, IMS Nanofabrication GmbH, Vienna, Austria

Technical Project Manager

”MBMW-201 – The multi-beam mask writer advanced to the 2nd tool generation”

Annette Schnettelker, IMS Nanofabrication GmbH, Vienna, Austria

Technical Project Manager

”MBMW-201 – The multi-beam mask writer advanced to the 2nd tool generation”

BORK_Ingo_Photo

Ingo Bork, Invited Speaker

Ingo Bork, Mentor, A Siemens Business, Fremont, California, USA

Product Manager - MPC

”MPC strategies for Multi-Beam Mask Writers”

BORK_Ingo_Photo

Ingo Bork, Mentor, A Siemens Business, Fremont, California, USA

Product Manager - MPC

”MPC strategies for Multi-Beam Mask Writers”

Ingo Bork, Mentor, A Siemens Business, Fremont, California, USA

Product Manager - MPC

”MPC strategies for Multi-Beam Mask Writers”

Hiroshi Matsumoto, Invited Speaker

Hiroshi Matsumoto, NuFlare Technology, Yokohama, Japan

Design and development of writing system of multi-beam mask writer

“Multi-beam mask writer MBM-1000”

Hiroshi Matsumoto, NuFlare Technology, Yokohama, Japan

Design and development of writing system of multi-beam mask writer

“Multi-beam mask writer MBM-1000”

Kurt Ronse, Invited Speaker

Kurt Ronse, IMEC, Belgium,

Director Advanced Lithography Program

“EUVL is being inserted in manufacturing in 2019.

What are the mask related challenges remaining ?”

Kurt Ronse, IMEC, Belgium,

Director Advanced Lithography Program

“EUVL is being inserted in manufacturing in 2019.

What are the mask related challenges remaining ?”

ZAHLTEN_Claus_Photo

Claus Zahlten, Invited Speaker

Claus Zahlten, Carl Zeiss SMT GmbH, Oberkochen, Germany

Lead Systems Engineer High-NA EUV

”High-NA EUV lithography – pushing the limits”

ZAHLTEN_Claus_Photo

Claus Zahlten, Carl Zeiss SMT GmbH, Oberkochen, Germany

Lead Systems Engineer High-NA EUV

”High-NA EUV lithography – pushing the limits”

Jo-Finders

Jo Finders, Invited Speaker

Jo Finders, ASML Netherlands B.V., Veldhoven, The Netherlands

ASML Fellow and group leader system engineering

“EUV Lithography: Update on Scanner and Infrastructure Progress”

Jo-Finders

Jo Finders, ASML Netherlands B.V., Veldhoven, The Netherlands

ASML Fellow and group leader system engineering

“EUV Lithography: Update on Scanner and Infrastructure Progress”

Xiaolong_Wang

Best Poster of BACUS EUV Lithography 2018 and Update

Xiaolong Wang, PSI, Villigen PSI, Switzerland

Manager of EUV resist screen projects

“Progress in EUV resists for Contact Holes Printing using EUV Interference lithography"

Xiaolong_Wang

Xiaolong Wang, PSI, Villigen PSI, Switzerland

Manager of EUV resist screen projects

“Progress in EUV resists for Contact Holes Printing using EUV Interference lithography"

Weiming Ren, Invited Speaker

Weiming Ren, Hermes Microvision Inv. (an ASML company), San Jose, California, USA

ASML Fellow and senior electron optics scientist

”Multi-Beam Technology for Defect Inspection of Wafer and Mask”

Weiming Ren, Hermes Microvision Inv. (an ASML company), San Jose, California, USA

ASML Fellow and senior electron optics scientist

”Multi-Beam Technology for Defect Inspection of Wafer and Mask”

LE-GRATIET_Bertrand_Photo

Betrand Le-Gratiet, Invited Speaker

Betrand Le-Gratiet, STMicroelectronics, Crolles, France

Senior Member of technical staff | Lithography metrology department

“Lithography Challenges for Optical Sensors”

LE-GRATIET_Bertrand_Photo

Betrand Le-Gratiet, STMicroelectronics, Crolles, France

Senior Member of technical staff | Lithography metrology department

“Lithography Challenges for Optical Sensors”

Betrand Le-Gratiet, STMicroelectronics, Crolles, France

Senior Member of technical staff | Lithography metrology department

“Lithography Challenges for Optical Sensors”

Andreas Erdmann

Andreas Erdmann, Best Paper of BACUS Photomask Technology 2018, on behalf of Vicky Philipsen / IMEC, Leuven, Belgium

Andreas Erdmann, Fraunhofer IISB, Erlangen, Germany

Head of the Fraunhofer IISB lithography and optics group

"Novel EUV mask absorber evaluation in support of next-generation EUV imaging"

Andreas Erdmann

Andreas Erdmann, Fraunhofer IISB, Erlangen, Germany

Head of the Fraunhofer IISB lithography and optics group

"Novel EUV mask absorber evaluation in support of next-generation EUV imaging"

Martin Heusinger, Inivted Speaker

Martin Heusinger, Friedrich Schiller University Jena, Jena, Germany

Scientific co-worker and Ph.D. student of the Institute of Applied Physics

“Optical micro- and nano-structures with (sub-)nanometer accuracy”

Martin Heusinger, Friedrich Schiller University Jena, Jena, Germany

Scientific co-worker and Ph.D. student of the Institute of Applied Physics

“Optical micro- and nano-structures with (sub-)nanometer accuracy”

Martin Heusinger, Friedrich Schiller University Jena, Jena, Germany

Scientific co-worker and Ph.D. student of the Institute of Applied Physics

“Optical micro- and nano-structures with (sub-)nanometer accuracy”

ORTLOFF_Dirk_Photo (1)

Dirk Ortloff, Invited Speaker

Dirk Ortloff, camLine GmbH, Petershausen, Germany

Department Manager Data Analysis Products

“Applying Big Data technologies to high tech manufacturing”

ORTLOFF_Dirk_Photo (1)

Dirk Ortloff, camLine GmbH, Petershausen, Germany

Department Manager Data Analysis Products

“Applying Big Data technologies to high tech manufacturing”

Monday afternoon, June 17th 2019

EMLC2019 Tutorials

14:00 (2:00 PM)  – 18:30 (6:30 PM)  

1st Tutorial       

Andreas Erdmann / FhG IISB, Erlangen, Germany,
Head of the Fraunhofer IISB lithography and optics group
"Alternative Lithographic Techniques for Non-IC Applications"

2nd Tutorial

Laurent Pain, CEA-LETI, Grenoble, France
Head of Business Development Silicon Technologies
Division Patterning program manager
"Lithography Alternative Solutions"

3rd Tutorial

Martin Sczyrba, Advanced Mask Technology Centre GmbH & Co KG (AMTC),
Dresden Germany
Senior Member of Technical Staff – Line Engineering
”Photomask Making Processes and Technologies”            

Tuesday, June 18th, 2019        

EMLC2019 Keynote Speakers

1st Keynote      

Udo Bischof, Robert Bosch GmbH, Reutlingen, Germany
Director Engineering Sensor Process Technology (EPT)
“Future Trends and Drivers for Sensor Technologies”

2nd Keynote

Naoya Hayashi, Dai Nippon Printing Co., Ltd (DNP), Japan
“Electron Multi-Beam Writing of Leading-Edge Masks and
NIL Master Templates”

3rd Keynote

Harry J. Levinson, HJL Lithography, Saratoga, California, USA
“The Potential of EUV Lithography”

Tuesday, June 18th, and Wednesday, June 19th, 2019           

EMLC2019 Invited Speakers

Robert Franke, City of Dresden – Department of Economics Development, Dresden, Germany
Director Office of Economics Development – City of Dresden
“Smart City Dresden - Bringing Future Technologies on the Road”

Best Poster of BACUS Photomask Technology 2018   
André Eilert,  Advanced Mask Technology Ctr. GmbH Co. KG, Dresden, Germany
Process Engineer Lithography Module
“Multiple exposure on single blank for electron-beam
writer characterization”

Masahiro Hashimoto, HOYA Group / Blanks division, Nagasaka, Hokuto, Yamanashi, Japan
General Manager, Optical Blanks Technology Development,
”Continuous challenges for next era of lithography”

Annette Schnettelker, IMS Nanofabrication GmbH, Vienna, Austria
Technical Project Manager
”MBMW-201 – The multi-beam mask writer advanced to the 2nd tool generation”

Ingo Bork, Mentor, A Siemens Business, Fremont, California, USA
Product Manager - MPC
”MPC strategies for Multi-Beam Mask Writers”

Hiroshi Matsumoto, NuFlare Technology, Yokohama, Japan
Design and development of writing system of multi-beam mask writer
“Multi-beam mask writer MBM-1000”

Kurt Ronse, IMEC, Belgium,
Director Advanced Lithography Program
“EUVL is being inserted in manufacturing in 2019.
What are the mask related challenges remaining ?”

Claus Zahlten, Carl Zeiss SMT GmbH, Oberkochen, Germany
Lead Systems Engineer High-NA EUV
”High-NA EUV lithography – pushing the limits”  

Jo Finders, ASML Netherlands B.V., Veldhoven, The Netherlands
ASML Fellow  and group leader system engineering
“EUV Lithography: Update on Scanner and Infrastructure Progress” 

Best Poster of BACUS EUV Lithography 2018 and Update
Xiaolong Wang, PSI, Villigen PSI, Switzerland
Manager of EUV resist screen projects
“Progress in EUV resists for Contact Holes Printing using EUV Interference lithography"

Weiming Ren, Hermes Microvision Inv. (an ASML company)
ASML Fellow and senior electron optics scientist , San José, California, USA
”Multi-Beam Technology for Defect Inspection of Wafer and Mask”

Betrand Le-Gratiet, STMicroelectronics, Crolles, France
Senior Member of technical staff | Lithography metrology department
“Lithography Challenges for Optical Sensors”

Best Paper of BACUS2018, on behalf of Vicky Philipsen, IMEC, Leuven, Belgium:
Andreas Erdmann, Fraunhofer IISB, Erlangen, Germany
Head of the Fraunhofer IISB lithography and optics group
"Novel EUV mask absorber evaluation in support of next-generation EUV imaging"

Martin Heusinger, Friedrich Schiller University Jena, Jena, Germany
Scientific co-worker and Ph.D. student of the Institute of Applied Physics
“Optical micro- and nano-structures with (sub-)nanometer accuracy”

Dirk Ortloff, camLine GmbH, Augsburg, Germany
Department Manager Data Analysis Products
“Applying Big Data technologies to high tech manufacturing”

emlc2019-program-download

Program - EMLC 2019

Publishing date: 2019-04-30
PDF: 262 KB

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