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www.emlc-conference.com

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2018-08-06 event information 703 0

Program

The focus of this 3 day conference is state-of-the-art of mask technology and lithography, such as mask manufacturing, mask business, lithography and mask applications, emerging mask & lithography technologies, and mask & lithography equipment.

Andreas Erdmann

Andreas Erdmann, 1st Tutorial

Andreas Erdmann / FhG IISB, Erlangen, Germany,

Head of the Fraunhofer IISB lithography and optics group

"Alternative Lithographic Techniques for Non-IC Applications"

Andreas Erdmann

Andreas Erdmann / FhG IISB, Erlangen, Germany,

Head of the Fraunhofer IISB lithography and optics group

"Alternative Lithographic Techniques for Non-IC Applications"

Laurent Pain

Laurent Pain, 2nd Tutorial

Laurent Pain, CEA-LETI, Grenoble, France

Head of Business Development Silicon Technologies

Division Patterning program manager

"Lithography Alternative Solutions"

Laurent Pain

Laurent Pain, CEA-LETI, Grenoble, France

Head of Business Development Silicon Technologies

Division Patterning program manager

"Lithography Alternative Solutions"

Sczyrba

Martin Sczyrba, 3rd Tutorial

Martin Sczyrba, Advanced Mask Technology Centre GmbH & Co KG (AMTC),

Dresden Germany

Senior Member of Technical Staff – Line Engineering

„Photomask Making Processes and Technologies”

Sczyrba

Martin Sczyrba, Advanced Mask Technology Centre GmbH & Co KG (AMTC),

Dresden Germany

Senior Member of Technical Staff – Line Engineering

„Photomask Making Processes and Technologies”

Bischof

Udo Bischof, 1st Keynote

Udo Bischof, Robert Bosch GmbH, Reutlingen, Germany

Director Engineering Sensor Process Technology (EPT)

“Future Trends and Drivers for Sensor Technologies”

Bischof

Udo Bischof, Robert Bosch GmbH, Reutlingen, Germany

Director Engineering Sensor Process Technology (EPT)

“Future Trends and Drivers for Sensor Technologies”

Naoya Hayashi

Naoya Hayashi, 2nd Keynote

Naoya Hayashi, Dai Nippon Printing Co., Ltd (DNP), Japan

“Electron Multi-Beam Writing of Leading-Edge Masks and

NIL Master Templates”

Naoya Hayashi

Naoya Hayashi, Dai Nippon Printing Co., Ltd (DNP), Japan

“Electron Multi-Beam Writing of Leading-Edge Masks and

NIL Master Templates”

Harry Levinson, 3rd Keynote

Harry J. Levinson, HJL Lithography, USA

“The Potential of EUV Lithography”

Harry J. Levinson, HJL Lithography, USA

“The Potential of EUV Lithography”

André Eilert, Best Poster BACUS 2018

Andre Eilert, Advanced Mask Technology

Ctr. GmbH Co. KG, Dresden, Germany

“Multiple exposure on single blank for electron-beam

writer characterization”

Andre Eilert, Advanced Mask Technology

Ctr. GmbH Co. KG, Dresden, Germany

“Multiple exposure on single blank for electron-beam

writer characterization”

Masahiro Hashimoto, Invited Speaker

Masahiro Hashimoto, HOYA Microelectronics Taiwan CO.,Ltd., Taiwan (R.O.C.)

General Manager, Optical Blanks Technology Development,

”Continuous challenges for next era of lithography”

Masahiro Hashimoto, HOYA Microelectronics Taiwan CO.,Ltd., Taiwan (R.O.C.)

General Manager, Optical Blanks Technology Development,

”Continuous challenges for next era of lithography”

Kurt Ronse, Invited Speaker

Kurt Ronse, IMEC, Belgium,

Director Advanced Lithography Program

“EUVL is being inserted in manufacturing in 2019.

What are the mask related challenges remaining ?”

Kurt Ronse, IMEC, Belgium,

Director Advanced Lithography Program

“EUVL is being inserted in manufacturing in 2019.

What are the mask related challenges remaining ?”

Dirk Ortloff, Invited Speaker

Dirk Ortloff, camLine GmbH, Germany

Department Manager Data Analysis Products

“Applying Big Data technologies to high tech manufacturing”

Dirk Ortloff, camLine GmbH, Germany

Department Manager Data Analysis Products

“Applying Big Data technologies to high tech manufacturing”

Monday afternoon, June 17th 2019


EMLC2019 Tutorials

14:00 (2:00 PM)  – 18:30 (6:30 PM)  

1st Tutorial       

Andreas Erdmann / FhG IISB, Erlangen, Germany,
Head of the Fraunhofer IISB lithography and optics group
"Alternative Lithographic Techniques for Non-IC Applications"

2nd Tutorial

Laurent Pain, CEA-LETI, Grenoble, France
Head of Business Development Silicon Technologies
Division Patterning program manager
"Lithography Alternative Solutions"

3rd Tutorial

Martin Sczyrba, Advanced Mask Technology Centre GmbH & Co KG (AMTC),
Dresden Germany
Senior Member of Technical Staff – Line Engineering
„Photomask Making Processes and Technologies”

EMLC2019 Keynote Speakers

1st Keynote      

Udo Bischof, Robert Bosch GmbH, Reutlingen, Germany
Director Engineering Sensor Process Technology (EPT)
“Future Trends and Drivers for Sensor Technologies”

2nd Keynote

Naoya Hayashi, Dai Nippon Printing Co., Ltd (DNP), Japan
“Electron Multi-Beam Writing of Leading-Edge Masks and
NIL Master Templates”

3rd Keynote

Harry J. Levinson, HJL Lithography, USA
“The Potential of EUV Lithography”

EMLC2019 Invited Speakers (to be continued)

Best Poster of BACUS 2018   
Andre Eilert,  Advanced Mask Technology
Ctr. GmbH Co. KG, Dresden, Germany
“Multiple exposure on single blank for electron-beam
writer characterization”

Masahiro Hashimoto, HOYA Microelectronics Taiwan CO.,Ltd., Taiwan (R.O.C.)
General Manager, Optical Blanks Technology Development,
”Continuous challenges for next era of lithography”

Kurt Ronse, IMEC, Belgium,
Director Advanced Lithography Program
“EUVL is being inserted in manufacturing in 2019.
What are the mask related challenges remaining ?”

Dirk Ortloff, camLine GmbH, Germany
Department Manager Data Analysis Products
“Applying Big Data technologies to high tech manufacturing”

Cooperating Partners