EMLC
EMLC 2019 | June 17 - 19 | Dresden | Germany

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Welcome to the EMLC 2019 Conference

The VDE/VDI-Society Microelectronics, Microsystems and Precision Engineering (GMM) and UBC Microelectronics in cooperation with BACUS, PMJ, SEMI-Europe, and SPIE, are pleased to announce the

35th European Mask and Lithography Conference, EMLC 2019
at the Hilton Hotel in Dresden, Germany on June 17th - June 19th, 2019

The focus of this 3 day conference is state-of-the-art of mask technology and lithography, such as mask manufacturing, mask business, lithography and mask applications, emerging mask & lithography technologies, and mask & lithography equipment.

This conference has annually brought together scientists, researchers, engineers and developers from around the world to present papers at the forefront of research, manufacturing and application. It provides a place where both specialists from industry and advanced research as well as equipment and software providers become acquainted with new developments and results.

Uwe Behringer

Dr. Uwe Behringer
Conference Chairman

UBC Microelectronics
phone.: +49 171 455 3196
e-Mail: uwe.behringer.ubc@t-online.de

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Target Audience

The EMLC Conference has annually brought together scientists, researchers, engineers and developers from around the world to present innovations at the forefront of research, manufacturing and application.

Icon Zielgruppe

The EMLC Conference has annually brought together scientists, researchers, engineers and developers from around the world to present innovations at the forefront of research, manufacturing and application.

It provides a place where both specialists from industry and advanced research as well as equipment and software providers become acquainted with new developments and results.

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Conference topics

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Mask Manufacturing and Mask Business

  • Multi-Beam Writing of Leading-Edge Masks and NIL Master Templates
  • Mask Data Preparation
  • Pattern Generation: Writing, Etch, etc.
  • Photomask Processes & Materials
  • Metrology Tools & Technologies
  • Defect Inspection & Repair
  • Cleaning & Haze
  • Pellicles & Mask Boxes
  • Mask Process Yield & Cycle Time
  • Photomasks for RET (OPC, ILT) ; PSM
  • Mask Business and Management
  • Mask Cost and Mask Development Strategy
  • Future Mask Demand

 Lithographic Systems and Processes

  • Optical Resolution Enhancements including OPC, Freeform Illumination, Source-Mask-optimization (SMO) and Inverse Lithography Technology (ILT)
  • Material-and Process driven Resolution Enhancements including Multiple Patterning and Chemical Shrinking
  • Immersion Lithography including Defectivity
  • Lithography Process Control
  • Lithography and Etch Simulation including rigorous physical/chemical Models and Compact Models

 Emerging Mask and Lithography Technologies

  • EUV-Lithography including Masks, Materials Processes and Infrastructure.
  • Nano-Imprint Lithography (NIL)
  • Directed Self-Assembly (DSA) including High Chi Materials, Defectivity Control, and new Processes
  • Direct Write / Maskless Technologies 

Emerging Applications

  • Non-IC Applications including Si-Photonics, Flat Panel Displays and MEMS
  • Lithographic Systems for non-IC Applications, including Laser Direct Write, Interference Lithography, and Mask Aligners
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Call for Papers

We invite all experts specialised in mask technology and lithography to present new researches, new projects as to the above listed topics and submit a paper.

The paper submission deadline is April 12, 2019.

Icon Call for Papers

We invite all experts specialised in mask technology and lithography to present new researches, new projects as to the above listed topics and submit a paper.

The paper submission deadline is April 12, 2019.

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Poster Session

The poster session is an important part of the conference, offering great opportunities for intensive discussions on selected papers.

It allows the interchange of new results and personal discussions.

Icon Postersession

The poster session is an important part of the conference, offering great opportunities for intensive discussions on selected papers.

It allows the interchange of new results and personal discussions.

A very intense discusssion can take place in front of the poster boards thanks to personal dialogues.

Authors presenting posters will have the same possibilities of publishing their papers as authors of oral presentations.

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Exhibition

During the conference, there will be a technical exhibition with booth space for about 20 exhibitors.

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During the conference, there will be a technical exhibition with booth space for about 20 exhibitors.

To sign up for the Technical Exhibition, please return the registration form as soon as possible since exhibition space is limited.

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Downloads

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Downloads + Links

Venue

Location

Location

By air
Dresden Airport
Distance from hotel: 10 km.
Driving time: 20 min.
Directions: From Dresden Airport follow signs for Zentrum, then go over Carola Bridge. Turn left at first traffic lights and follow signs to the Hilton Dresden Hotel.
Get turn by turn directions.
Transportation to and from the airport
By car
in the navigation device Dresden and enter "An der Frauenkirche 5"
By train
from Berlin in 3 hours
from Frankfurt in 5 hours

 

Hilton Dresden
Downloads + Links
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Accommodation

Hotel

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Hotel

For your hotel bookings please use the following link.

Hotel Booking
Hilton Dresden
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Proceedings

The EMLC proceedings will be published by SPIE and made avaible at the SPIE Digital Library.

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The EMLC proceedings will be published by SPIE and made avaible at the SPIE Digital Library.

Downloads + Links
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Committee Members

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The EMLC 2019 International Program Committee

Conference Chairs
Behringer, Uwe, UBC Microelectronics, Ammerbuch, Germany
Finders, Jo, ASML, Veldhoven, The Netherlands

Conference Co-Chairs
Connolly, Brid, Toppan Photomasks Inc., Dresden, Germany
Gale, Chris, Applied Materials, Dresden, Germany
Hayashi, Naoya, DNP, Saitama, Japan

Program Chairs
Stolberg, Ines, Vistec Electron Beam, Jena, Germany
Erdmann, Andreas, Fraunhofer IISB, Erlangen, Germany

Program Co-Chairs
Seltmann, Rolf, Globalfoundries, Dresden, Germany
Sarlette, Daniel, Infineon, Dresden, Germany

Other Program Committee Members
Ehrmann, Albrecht, Carl Zeiss SMT Oberkochen, Germany
Farrar, Dave, HOYA Corporation, London, UK
Galler, Reinhard, Equicon, Jena, Germany
Kapilevich, Izak, AMAT, USA
Le Gratiet, Bertrand, ST Microelectronics, Crolles, France
Loeschner, Hans, IMS Nanofabrication GmbH, Vienna, Austria
Muehlberger, Michael, Profactor GmbH, Steyr-Gleink, Austria
Pain, Laurent, CEA, Grenoble, France
Peters, Jan Hendrik, bmbg consult, Radebeul, Germany
Roeth, Klaus-Dieter, KLA-Tencor MIE, Weilburg, Germany
Savari, Serap, Texas A&M University College Station, USA
Scheruebl, Thomas, Carl Zeiss SMT GmbH, Jena, Germany
Schnabel, Ronald, VDE/VDI-GMM, Frankfurt, Germany
Schulze, Steffen, Mentor Graphics Corp. Wilsonville, OR, USA
Tschinkl, Martin, AMTC, Dresden, Germany
Waelpoel, Jacques, ASML, Veldhoven The Netherlands
Wiley, Jim, USA
Wolf, Hermann, Photronics MZD GmbH, Dresden, Germany
Wurm, Stefan, ATICE LLC, Albany, NY, USA
Yoshitake, Shushuke, NuFlare, Japan
Zurbrick, Larry, Keysight Technologies, Santa Clara, CA, USA

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Contact

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Please contact GMM-Office for questions concerning the conference.

You would like to be informed about the next steps concerning this conference? So please register as prospective customer.

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Past Events

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You can find information about the past events here on the webpage.

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Cooperating Partners