EMLC
EMLC 2019 | June 17 - 19 | Dresden | Germany

Contact

Uwe Behringer

Dr. Uwe Behringer
Conference Chairman

UBC Microelectronics
phone.: +49 171 455 3196
e-Mail: uwe.behringer.ubc@t-online.de

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Target Audience

The EMLC Conference has annually brought together scientists, researchers, engineers and developers from around the world to present innovations at the forefront of research, manufacturing and application.

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The EMLC Conference has annually brought together scientists, researchers, engineers and developers from around the world to present innovations at the forefront of research, manufacturing and application.

It provides a place where both specialists from industry and advanced research as well as equipment and software providers become acquainted with new developments and results.

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Registration

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To register for EMLC 2019, please fill in the registration form and return it to VDE Conference Services, Stresemannallee 15, 60596 Frankfurt, Germany. To benefit from the "early-bird-discount", VDE Conference Services must receive the form before May 18, 2019. Full payment or credit card information must accompany all registrations in order to be accepted. Completed forms may be sent by fax (++49 69 6308 144) or e-mail (vde-conferences@vde.com). A confirmation of the registration will be sent upon receipt of full payment.

Cancellation
In case of cancellation, provided that written notice has been given to VDE-Conference Services befor May 18, 2019, the registration fee will be fully refunded less a handling fee of Euro 80.00. After that date, no refund will be made. Proceedings will then be sent to the registrant after the conference.

Online Registration
Registrations for the conference may also be done online.

Online Registration
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Poster Session

The poster session is an important part of the conference, offering great opportunities for intensive discussions on selected papers.

It allows the interchange of new results and personal discussions.

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The poster session is an important part of the conference, offering great opportunities for intensive discussions on selected papers.

It allows the interchange of new results and personal discussions.

A very intense discusssion can take place in front of the poster boards thanks to personal dialogues.

Authors presenting posters will have the same possibilities of publishing their papers as authors of oral presentations.

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Exhibition

Die tagungsbegleitende Fachausstellung hat große Tradition und ist bei Teilnehmern wie Ausstellern sehr beliebt.

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Die tagungsbegleitende Fachausstellung hat große Tradition und ist bei Teilnehmern wie Ausstellern sehr beliebt.

The exhibition is the communicative core of the conference. Manufacturers and service provides present future and praxis oriented applications and products.

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Downloads

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Downloads + Links

Venue

Location

Location

By air
Dresden Airport
Distance from hotel: 10 km.
Driving time: 20 min.
Directions: From Dresden Airport follow signs for Zentrum, then go over Carola Bridge. Turn left at first traffic lights and follow signs to the Hilton Dresden Hotel.
Get turn by turn directions.
Transportation to and from the airport
By car
in the navigation device Dresden and enter "An der Frauenkirche 5"
By train
from Berlin in 3 hours
from Frankfurt in 5 hours

 

Hilton Dresden
Downloads + Links
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Accommodation

Hotel

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Hotel

For your hotel bookings please use the following link.

Hotel Booking
Hilton Dresden
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Proceedings

The EMLC proceedings will be published by SPIE and made avaible at the SPIE Digital Library.

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The EMLC proceedings will be published by SPIE and made avaible at the SPIE Digital Library.

Downloads + Links
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Committee Members

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The EMLC 2019 International Program Committee

Conference Chairs
Behringer, Uwe, UBC Microelectronics, Ammerbuch, Germany
Finders, Jo, ASML, Veldhoven, The Netherlands

Conference Co-Chairs
Connolly, Brid, Toppan Photomasks Inc., Dresden, Germany
Gale, Chris, Applied Materials, Dresden, Germany
Hayashi, Naoya, DNP, Saitama, Japan

Program Chairs
Stolberg, Ines, Vistec Electron Beam, Jena, Germany
Erdmann, Andreas, Fraunhofer IISB, Erlangen, Germany

Program Co-Chairs
Seltmann, Rolf, Globalfoundries, Dresden, Germany
Sarlette, Daniel, Infineon, Dresden, Germany

Other Program Committee Members
Ehrmann, Albrecht, Carl Zeiss SMT Oberkochen, Germany
Farrar, Dave, HOYA Corporation, London, UK
Galler, Reinhard, Equicon, Jena, Germany
Kapilevich, Izak, AMAT, USA
Le Gratiet, Bertrand, ST Microelectronics, Crolles, France
Loeschner, Hans, IMS Nanofabrication GmbH, Vienna, Austria
Muehlberger, Michael, Profactor GmbH, Steyr-Gleink, Austria
Pain, Laurent, CEA, Grenoble, France
Peters, Jan Hendrik, bmbg consult, Radebeul, Germany
Roeth, Klaus-Dieter, KLA-Tencor MIE, Weilburg, Germany
Savari, Serap, Texas A&M University College Station, USA
Scheruebl, Thomas, Carl Zeiss SMT GmbH, Jena, Germany
Schnabel, Ronald, VDE/VDI-GMM, Frankfurt, Germany
Schulze, Steffen, Mentor Graphics Corp. Wilsonville, OR, USA
Tschinkl, Martin, AMTC, Dresden, Germany
Waelpoel, Jacques, ASML, Veldhoven The Netherlands
Wiley, Jim, USA
Wolf, Hermann, Photronics MZD GmbH, Dresden, Germany
Wurm, Stefan, ATICE LLC, Albany, NY, USA
Yoshitake, Shushuke, NuFlare, Japan
Zurbrick, Larry, Keysight Technologies, Santa Clara, CA, USA

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Contact

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Please contact GMM-Office for questions concerning the conference.

You would like to be informed about the next steps concerning this conference? So please register as prospective customer.

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Past Events

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You can find information about the past events here on the webpage.

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Cooperating Partners